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semiconductor cnc machining

Specializing in CNC automated machining for semiconductor and plastic parts manufacturing.

Hongsinn-398
Unlocking precision and efficiency in semiconductor and plastic parts manufacturing through our expertise in CNC automated machining. Trust us for unparalleled quality and reliability in every component produced.
Delivery
FOB
minimum order
1 piece
Supply Ability
5000piece / Week
Country of Origin
Shenzhen
Stock Time
7~15Day
Quantity:
US $0.50 - US $10.89 / piece
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Specializing in CNC automated machining for semiconductor and plastic parts manufacturing.

In the fast-evolving semiconductor and electronics industries, semiconductor CNC machining plays a critical role in producing ultra-precision components. Coupled with CNC automated machining advancements, leading plastic parts manufacturers deliver high-performance solutions for wafer handling, test sockets, and microfluidic devices.
 
Our Services
CNC Turning, CNC Milling, Laser Cutting, Bending, Spinning, Wire Cutting, Stamping, Electric Discharge Machining (EDM), Injection Molding.
Materials Available
Aluminum: 2000 series, 6000 series, 7075, 5052, etc.
Stainless Steel: SUS303, SUS304, SS316, SS316L, 17-4PH, etc.
 
Steel: 1214L/1215/1045/4140/SCM440/40CrMo, etc.
 
Brass: 260, C360, H59, H60, H62, H63, H65, H68, H70, Bronze, Copper.
 
Titanium: Grade F1-F5.
 
Plastic: Acetal/POM/PA/Nylon/PC/PMMA/PVC/PU/Acrylic/ABS/PTFE/PEEK etc.
Surface Treatment
Anodized, Bead Blasted, Silk Screen, PVD Plating, Zinc/Nickel/Chrome/Titanium Plating, Brushing, Painting, Powder Coated, Passivation, Electrophoresis, Electro Polishing, Knurl, Laser/Etch/Engrave etc.
Tolerance
±0.002 ~ ±0.005mm
Surface Roughness
Min Ra 0.1~3.2
 

Wafer Manufacturing Processing Parts


During the wafer manufacturing process, we provide machined parts for applications such as oxidation, lithography, etching, and inspection. These parts vary greatly in complexity, size, and material, making the right CNC equipment and expertise critical to ensuring their accurate manufacture.
Our team has extensive experience handling a wide range of materials and complex design requirements, ensuring each part meets stringent industry standards. Regardless of your project needs, we can provide high-quality solutions to support your wafer manufacturing process.
 

Researching New Materials


In semiconductor manufacturing, we use components made from a variety of non-metallic materials, including ceramics, quartz, polyurethane, and silicon carbide. Each material presents unique processing challenges, especially when considering the stringent tolerances required by the industry.

We focus on researching and developing new materials to address these challenges and improve the efficiency of manufacturing processes. Our team continuously explores new technologies and methods to ensure the efficient processing and application of these materials while meeting high standards, driving progress in the semiconductor industry.Researching New Materials
In semiconductor manufacturing, we use components made from a variety of non-metallic materials, including ceramics, quartz, polyurethane, and silicon carbide. Each material presents unique processing challenges, especially when considering the stringent tolerances required by the industry.

We focus on researching and developing new materials to address these challenges and improve the efficiency of manufacturing processes. Our team continuously explores new technologies and methods to ensure the efficient processing and application of these materials while meeting high standards, driving progress in the semiconductor industry.

semiconductor cnc machiningsemiconductor cnc machiningsemiconductor cnc machining

Precision, Complexity, and Specialization


Semiconductor production is an extremely complex and precise manufacturing process, requiring components to be manufactured to the tightest tolerances. Below are some examples of applications, along with the technical support we provide to our customers and other considerations:
 
Application Examples:
Wafer Fabrication: This involves steps such as oxidation, photolithography, and etching, requiring high-precision parts.
Testing and Packaging: Components are quality-tested and packaged to ensure performance and reliability.
 
Technical Support:
Specialized Equipment: Advanced CNC and laser processing equipment is used to ensure high-precision and high-quality part manufacturing.
Material Selection: Appropriate materials, such as ceramics, polyurethane, and silicon carbide, are selected based on application requirements to meet specific performance requirements.
Precision, Complexity, and Specialization
Semiconductor production is an extremely complex and precise manufacturing process, requiring components to be manufactured to the tightest tolerances. Below are some examples of applications, along with the technical support we provide to our customers and other considerations:
 
Application Examples:
Wafer Fabrication: This involves steps such as oxidation, photolithography, and etching, requiring high-precision parts.
Testing and Packaging: Components are quality-tested and packaged to ensure performance and reliability.
 
Technical Support:
Specialized Equipment: Advanced CNC and laser processing equipment is used to ensure high-precision and high-quality part manufacturing.
Material Selection: Appropriate materials, such as ceramics, polyurethane, and silicon carbide, are selected based on application requirements to meet specific performance requirements.
FAQ:

Q1:What's kinds of information you need for quotation?

Hongsinn: You can provide 2D/3D drawing or send your sample to our factory, then we can make according to your sample.

Q2: Can we sign NDA?

Hongsinn: Sure. We never divulge customers' information to anyone else.

Q3: Do you provide sample?

Hongsinn: Yes, we can provide you sample before mass order.

Q4: How can you ensure the quality?

Hongsinn: We have profesional QC department to guarantee the quality.