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precision baseplate manufacturer

Large Precision CNC Machined Baseplate | Custom Semiconductor Wafer Carriers

Hongsinn-987
ISO-certified manufacturer for large-diameter precision CNC machined baseplates. Specializing in high-flatness wafer carriers and automation index plates. Tight tolerance ±0.01mm. Request a quote!
Delivery
FOB
minimum order
1 piece
Supply Ability
5000piece / Week
Country of Origin
Shenzhen
Stock Time
7~15Day
Quantity:
US $0.59 - US $10.68 / piece
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Product Overview

 

Product Overview


As a specialized provider of high-precision CNC machining services, we are dedicated to resolving the complex challenges associated with deformation and tolerance control during the machining of large-diameter, thin-walled components. This precision baseplate is specifically engineered for applications in the semiconductor, optics, and precision automation sectors; it ensures ultra-high flatness while achieving high-precision positional accuracy for complex hole patterns.
 
Leveraging 15 years of industrial manufacturing expertise, we are capable of processing a wide array of materials—including aerospace-grade aluminum, stainless steel, and specialized alloys—to deliver customized baseplate solutions that meet the world's most rigorous industrial standards.
 

Core Technical Advantages


Exceptional Flatness and Parallelism Control
Deformation is the primary concern when machining large-diameter, disc-shaped components. We employ unique stress-relief machining processes and vacuum-chucking techniques to ensure that our products maintain micron-level flatness even after machining is complete, thereby meeting the exacting demands of precision assembly.
 
High-Precision Positioning for Complex Hole Patterns
Utilizing advanced 4-axis and 5-axis CNC machining centers, we complete the machining of all precision holes and slots in a single setup. This fundamentally eliminates the cumulative errors typically associated with secondary setups, ensuring positional tolerances remain within ±0.01 mm.
 
Semiconductor-Grade Cleanliness and Surface Treatment
We fully understand the stringent requirements placed on components within semiconductor environments. We offer a comprehensive range of surface treatments—including hard anodizing, electropolishing, and Teflon coating—to ensure that components exhibit extremely low outgassing rates and exceptional corrosion resistance.
 
Fully Digitalized Quality Traceability
Every single baseplate undergoes 100% inspection using a Coordinate Measuring Machine (CMM). Through unique positional markings applied directly to the component's surface, you can easily and precisely cross-reference specific parts with their corresponding production batches and inspection data.
Product name
CNC machining services
Surface treatment
Anodizing, bead blasting, black oxide, polishing, powder coating, painting, brushing, electroplating, passivation, or customer’s requirements.
Material capacities
Metal: aluminum alloy, stainless steel, brass, copper, tool steel, carbon steel, iron. 
Plastic: ABS, POM, PC(Poly Carbonate), PC+GF, PA(nylon), PA+GF, PMMA(acrylic), PEEK, PEI, etc.
CNC processing scope
CNC 3-axis, 4-axis machining, CNC milling, CNC turning, CNC lathe, high precision 5-Axis turning-milling combined machining.
Tolerance
±0.002 ~ ±0.005mm
Surface roughness
Min Ra 0.02~3.2
Drawing format
IGS, STP, STEP, X_T, DXF, DWG, Pro/E, PDF, PNG, JPG.
Package
Tissue paper, EPE, standard carton or plastic tray, sponge tray, cardboard tray, etc, can be customized according to customer's requirements.
Delivery
DHL, FedEx, EMS, UPS, or customer's requirements.
 
precision automation componentsprecision automation components

Industry Applications
Industrial Robotics: High-precision joint shafts, bearing housings, and sensor enclosures.

Fluid & Power Systems: Precision valve cores, pistons, and heavy-duty flanges (such as the flange assembly shown in the image).
Semiconductor Equipment: High-cleanliness, high-precision internal chamber components and wafer carriers.
Medical Devices: Precision micro-components meeting biocompatibility requirements.